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- CY2309ZXC-1HT
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CY2309ZXC-1HT Tech Specifications
Cypress CY2309ZXC-1HT technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.
Factory Lead Time | 6 Weeks | |
Contact Plating | Gold, Tin | |
Mounting Type | Surface Mount | |
Package / Case | 16-TSSOP (0.173, 4.40mm Width) | |
Surface Mount | YES | |
Number of Pins | 16Pins | |
Operating Temperature | 0°C~70°C | |
Packaging | Tape & Reel (TR) | |
Published | 2005 | |
JESD-609 Code | e3 | |
Pbfree Code | yes | |
Part Status | Active | |
Moisture Sensitivity Level (MSL) | 3 (168 Hours) | |
Number of Terminations | 16Terminations | |
Type | Fanout Buffer (Distribution), Zero Delay Buffer | |
Terminal Finish | Matte Tin (Sn) | |
Voltage - Supply | 3V~3.6V | |
Terminal Position | DUAL | |
Terminal Form | GULL WING | |
Peak Reflow Temperature (Cel) | 260 | |
Number of Functions | 1Function | |
Supply Voltage | 3.3V | |
Terminal Pitch | 0.65mm | |
Frequency | 133.33MHz | |
Time@Peak Reflow Temperature-Max (s) | 30 | |
Base Part Number | CY2309 | |
Output | LVCMOS | |
Pin Count | 16 | |
Number of Outputs | 9Outputs | |
Operating Supply Voltage | 3.3V | |
Supply Voltage-Max (Vsup) | 3.6V | |
Supply Voltage-Min (Vsup) | 3V | |
Number of Circuits | 1Circuit | |
Nominal Supply Current | 32mA | |
Input | LVCMOS, LVTTL | |
Ratio - Input:Output | 1:9 | |
Max I(ol) | 0.008 A | |
PLL | Yes with Bypass | |
Differential - Input:Output | No/No | |
Propagation Delay (tpd) | 8.7 ns | |
Same Edge Skew-Max (tskwd) | 0.25 ns | |
Length | 5mm | |
Width | 4.4mm | |
REACH SVHC | No SVHC | |
Radiation Hardening | No | |
RoHS Status | ROHS3 Compliant | |
Lead Free | Lead Free |
CY2309ZXC-1HT Documents
Download datasheets and manufacturer documentation for CY2309ZXC-1HT
- DatasheetsCY2305,09
- Environmental InformationRoHS3 Certificate
- PCN Obsolescence/ EOLCS7331P-CAZR 02/Jul/2019
- PCN Assembly/OriginCopper Wire Bonds/Transfer 14/Jun/2013
- PCN PackagingNew Tray and TR Materials 13/Dec/2013 Ship Label/Document Standardization 24/Jan/2018 Mult Dev Cover Tape Chg 26/Sep/2019
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