TBP03R2-350-02BE Tech Specifications

CUI Devices  TBP03R2-350-02BE technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.

Contact Plating Tin
Mounting Type Through Hole
Housing Material Polyamide (PA)
RoHS Details
Mounting Styles PCB Mount
Voltage, Rating 300 VDC, 250 VDC
Contact Materials Copper Alloy
Current-IEC 7A
Voltage-UL 300 V
Voltage-IEC 250 V
Product Status Active
Current-UL 8 A
Torque-Screw -
Mfr CUI Devices
Package Box
Series TBP03R2-350
Operating Temperature -40°C ~ 105°C
Type Header, Male Pins, Shrouded (4 Side)
Number of Positions 2 PositionPosition
Color Blue
Pitch 3.5 mm
Ingress Protection -
Insulation Height 0.362 (9.20mm)
Current Rating +/- 7 A, +/- 8 A
Termination Style Through Hole
Contact Tail Length 0.134 (3.40mm)
Number of Levels 1Level
Contact Mating Finish Tin
Wire Gauge or Range - AWG -
Positions Per Level 2
Plug Wire Entry -
Header Orientation Vertical
Wire Gauge or Range - mm² -
Wire Strip Length -
Screw Size -
Product Sockets
Mounting Angle Vertical
Features Notch Guide
Height 7.2 mm
Length 7.8 mm
Width 9.2 mm
Material Flammability Rating UL94 V-0
Flammability Rating UL 94 V-0
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