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HSB25-282810 Tech Specifications

CUI Devices  HSB25-282810 technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.

Material Aluminum Alloy
Shape Square, Pin Fins
Package Cooled BGA
Material Finish Black Anodized
RoHS Details
Designed for BGA
Mounting Styles Adhesive
Heatsink Material Aluminum
Fin Style Vertical Fin
Package Box
Mfr CUI Devices
Product Status Active
Series HSB
Type BGA Heatsink
Color Black
Attachment Method Push Pin
Thermal Resistance @ Forced Air Flow 5.10°C/W @ 200 LFM
Thermal Resistance @ Natural 15.41°C/W
Power Dissipation @ Temperature Rise 4.87W @ 75°C
Product Heatsinks
Thermal Resistance 18.2 C/W
Length 28.5 mm
Width 28.5 mm
Height 10 mm
Diameter -
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HSB25-282810 brand manufacturers: CUI Devices, Twicea stock, HSB25-282810 reference price.CUI Devices. HSB25-282810 parameters, HSB25-282810 Datasheet PDF and pin diagram description download.You can use the HSB25-282810 Thermal - Heat Sinks, DSP Datesheet PDF, find HSB25-282810 pin diagram and circuit diagram and usage method of function,HSB25-282810 electronics tutorials.You can download from the Twicea.