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APF30-30-13CB/A01 Tech Specifications

CTS  APF30-30-13CB/A01 technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.

Body Material ALUMINUM 6063
Product Depth (mm) 30(mm)
Device Cooled BGA
Product Diameter (mm) Not Required(mm)
Rad Hardened No
Fin Style FORGED
Mounting Styles Adhesive
Heatsink Material Aluminum
Designed for BGA, PGA, PLCC, QFP
Temperature Coefficient 100 ppm/K
Type Passive
Resistance 215 kOhm
Power Rating 0.0625 W
Resistor Type General Purpose
Attachment Method Adhesive Tape
Resistance Tolerance 1
Finish Black Anodized
Product Heatsinks
Product Length 30 mm
Thermal Resistance 2.5 °C/W
Product Length (mm) 30(mm)
Width 30 mm
Height 12.7 mm
Length 30 mm
Product Height (mm) 12.7(mm)
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