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211-1-18-003 Tech Specifications

CnC Tech  211-1-18-003 technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.

Factory Lead Time 18 Weeks
Mounting Type Through Hole
Number of Pins 18Pins
Housing Material Polybutylene Terephthalate (PBT)
Number of Positions or Pins (Grid) 18 (2 x 9)
Contact Material - Mating Beryllium Copper
Contact Material - Post Brass
Contact Finish Mating Gold
Operating Temperature -55°C~105°C
Packaging Tube
Published 2012
Part Status Active
Moisture Sensitivity Level (MSL) 1 (Unlimited)
Termination Solder
Type DIP, 0.3 (7.62mm) Row Spacing
Current Rating (Amps) 3A
Pitch - Mating 0.100 2.54mm
Contact Finish - Post Tin
Contact Resistance 4mOhm
Termination Post Length 0.110 2.78mm
Pitch - Post 0.100 2.54mm
Features Open Frame
Contact Finish Thickness - Mating 10.0μin 0.25μm
Contact Finish Thickness - Post 200.0μin 5.08μm
Material Flammability Rating UL94 V-0
RoHS Status ROHS3 Compliant
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211-1-18-003 Documents

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