CML Innovative Technologies CMX602BP3 Telecom Interface ICs DUAL
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CMX602BP3 Tech Specifications
CML Innovative Technologies CMX602BP3 technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.
| Mounting Type | 18-gauge Insulated Wires | |
| Surface Mount | NO | |
| Number of Terminals | 16Terminals | |
| Manufacturer | BARKER MICROFARADS INC | |
| Package Description | DIP, | |
| Package Style | IN-LINE | |
| Package Body Material | PLASTIC/EPOXY | |
| Operating Temperature-Min | -40 °C | |
| Supply Voltage-Nom | 3 V | |
| Operating Temperature-Max | 85 °C | |
| Manufacturer Part Number | CMX602BP3 | |
| Package Code | DIP | |
| Package Shape | RECTANGULAR | |
| Part Life Cycle Code | Active | |
| Ihs Manufacturer | CML MICROCIRCUITS LTD | |
| Risk Rank | 5.3 | |
| Part Package Code | DIP | |
| Packaging | Case Code - 1 | |
| Size / Dimension | 1.437in W | |
| Tolerance | -0%/+20% | |
| HTS Code | 8542.39.00.01 | |
| Capacitance | 86uF | |
| Technology | CMOS | |
| Terminal Position | DUAL | |
| Terminal Form | THROUGH-HOLE | |
| Number of Functions | 1Function | |
| Terminal Pitch | 2.54 mm | |
| Reach Compliance Code | compliant | |
| Pin Count | 16 | |
| JESD-30 Code | R-PDIP-T16 | |
| Qualification Status | Not Qualified | |
| Temperature Grade | INDUSTRIAL | |
| Voltage | 165V | |
| Seated Height-Max | 5.08 mm | |
| Telecom IC Type | TELEPHONE CALLING NO IDENTIFICATION CIRCUIT | |
| Height Seated (Max) | 2.750in | |
| Width | 7.62 mm | |
| Length | 19.685 mm |
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