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PEX8616-BB50RBC F Tech Specifications
Broadcom PEX8616-BB50RBC F technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.
| Factory Lead Time | 12 Weeks | |
| Mounting Type | Surface Mount | |
| Surface Mount | YES | |
| Supplier Device Package | 324-FCBGA (19x19) | |
| Operating Temperature (Max.) | 70°C | |
| Packaging | Tray | |
| Series | ExpressLane™ | |
| Published | 2017 | |
| JESD-609 Code | e1 | |
| Part Status | Obsolete | |
| Moisture Sensitivity Level (MSL) | 4 (72 Hours) | |
| Number of Terminations | 324Terminations | |
| Terminal Finish | Tin/Silver/Copper (Sn/Ag/Cu) | |
| Applications | PCI Express® | |
| Terminal Position | BOTTOM | |
| Terminal Form | BALL | |
| Peak Reflow Temperature (Cel) | NOT SPECIFIED | |
| Supply Voltage | 1V | |
| Terminal Pitch | 1mm | |
| Reach Compliance Code | compliant | |
| Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED | |
| JESD-30 Code | S-PBGA-B324 | |
| Supply Voltage-Max (Vsup) | 1.05V | |
| Temperature Grade | COMMERCIAL | |
| Supply Voltage-Min (Vsup) | 0.95V | |
| uPs/uCs/Peripheral ICs Type | BUS CONTROLLER, PCI | |
| Bus Compatibility | I2C; ISA; SMBUS; SPI; VGA | |
| Features | Configurable | |
| Length | 19mm | |
| Height Seated (Max) | 2.48mm | |
| Width | 19mm | |
| RoHS Status | RoHS Compliant |
PEX8616-BB50RBC F Documents
Download datasheets and manufacturer documentation for PEX8616-BB50RBC F
- PCN Obsolescence/ EOLPEX Device LTB Update 28/Jul/2017
- PCN Part Status ChangePEX Device Eol 9/Jun/2017
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