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PEX8112-AA66BI F Tech Specifications

Broadcom  PEX8112-AA66BI F technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.

Factory Lead Time 12 Weeks
Mounting Type Surface Mount
Package / Case 144-BGA
Surface Mount YES
Operating Temperature (Max.) 85°C
Operating Temperature (Min.) -40°C
Packaging Tray
Series ExpressLane™
Published 2005
JESD-609 Code e1
Part Status Last Time Buy
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Number of Terminations 144Terminations
Terminal Finish Tin/Silver/Copper (Sn/Ag/Cu)
Applications PCI-to-PCI Bridge
HTS Code 8542.31.00.01
Voltage - Supply 3.3V 5V
Terminal Position BOTTOM
Terminal Form BALL
Peak Reflow Temperature (Cel) NOT SPECIFIED
Supply Voltage 1.5V
Terminal Pitch 1mm
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
JESD-30 Code R-PBGA-B144
Qualification Status Not Qualified
Power Supplies 1.53.33.3/5V
Temperature Grade INDUSTRIAL
Interface PCI
Supply Current-Max 207mA
Data Transfer Rate-Max 250 MBps
RoHS Status ROHS3 Compliant
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PEX8112-AA66BI F Documents

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