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HCPL-817-56BE Tech Specifications

Broadcom  HCPL-817-56BE technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.

Factory Lead Time 17 Weeks
Contact Plating Tin
Mount Surface Mount
Mounting Type Surface Mount
Package / Case 4-SMD, Gull Wing
Number of Pins 4Pins
Current Transfer Ratio-Min 130% @ 5mA
Number of Elements 1 Element
Operating Temperature -30°C~100°C
Packaging Tape & Reel (TR)
Published 2009
JESD-609 Code e3
Part Status Active
Moisture Sensitivity Level (MSL) 1 (Unlimited)
ECCN Code EAR99
Additional Feature UL RECOGNIZED, VDE APPROVED
Max Power Dissipation 200mW
Voltage - Isolation 5000Vrms
Output Voltage 70V
Output Type Transistor
Configuration SINGLE
Power Dissipation 200mW
Voltage - Forward (Vf) (Typ) 1.2V
Input Type DC
Forward Current 50mA
Max Output Voltage 70V
Output Current per Channel 50mA
Rise Time 18μs
Fall Time (Typ) 18 μs
Collector Emitter Voltage (VCEO) 200mV
Max Collector Current 50mA
Rise / Fall Time (Typ) 4μs 3μs
Reverse Breakdown Voltage 6V
Max Input Current 50mA
Input Current 20mA
Current Transfer Ratio (Max) 260% @ 5mA
REACH SVHC No SVHC
Radiation Hardening No
RoHS Status ROHS3 Compliant
Lead Free Lead Free
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HCPL-817-56BE Documents

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