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CMF-SDP50-2 Tech Specifications

Bourns  CMF-SDP50-2 technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.

Factory Lead Time 20 Weeks
Contact Plating Copper, Tin
Mount Surface Mount
Mounting Type Surface Mount
Package / Case 4-SMD Cube
Terminal Shape GULL WING
Resistance @ 25C 50Ohm
Operating Temperature -40°C~125°C
Packaging Tape & Reel (TR)
Series CMF-SDP
Published 2008
Size / Dimension 0.433Lx0.354W 11.00mmx9.00mm
Tolerance 15%
JESD-609 Code e3
Part Status Active
Moisture Sensitivity Level (MSL) 1 (Unlimited)
Number of Terminations 4Terminations
ECCN Code EAR99
Type Ceramic
Terminal Finish Tin (Sn)
HTS Code 8533.40.80.70
Voltage - Rated DC 230V
Packing Method TR, 13 INCH
Terminal Pitch 2.6mm
Reach Compliance Code not_compliant
Voltage - Rated AC 230V
Operating Supply Voltage 230V
Max Voltage Rating (AC) 220V
Max Current Rating 2.5A
Terminal Placement DUAL IN-LINE
Rated (AC) Voltage (URac) 600V
Hold Current 90mA
Thermistor Application OVERLOAD PROTECTION
Voltage - Max 230V 600V Int
Time to Trip 130ms
Trip Current 190mA
Height 11.5mm
Thickness (Max) 0.453 11.50mm
REACH SVHC No SVHC
RoHS Status ROHS3 Compliant
Lead Free Contains Lead
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CMF-SDP50-2 Documents

Download datasheets and manufacturer documentation for   CMF-SDP50-2

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