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BHI260AP Shuttle Board 3.0 Tech Specifications

Bosch Sensortec  BHI260AP Shuttle Board 3.0 technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.

Contact Plating Gold
Shell Material Stainless Steel
Shell Sizes 19
Shell Style# Wall Mount
MIL Type MIL-DTL-38999 III
Voltage, Rating 300 VAC, 450 VDC
Factory Pack QuantityFactory Pack Quantity 1
Mounting Styles Panel
Insert Arrangement 19-88
Contact Materials Copper Alloy
Mating Style Threaded
Manufacturer Amphenol
Brand Amphenol Aerospace
Tradename HD38999
RoHS Details
Part # Aliases 0440.SB6.368
Series TV 38999 III
Packaging Bulk
Number of Positions 88 PositionPosition
Subcategory Circular Connectors
Current Rating 5 A
Termination Style Crimp
Contact Gender Without Socket Contacts
Wire Gauge 28 AWG to 22 AWG
Product Type Circular MIL Spec Connector
Product Receptacles
Mounting Angle Straight
Product Category Circular MIL Spec Connector
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