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28-650000-10 Tech Specifications

Aries Electronics  28-650000-10 technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.

Factory Lead Time 5 Weeks
Contact Plating Tin
Package / Case DIP
Material FR4 Epoxy Glass
Package Accepted SOIC
Contact Materials Brass
Series Correct-A-Chip® 650000
Published 2010
Size / Dimension 2.800Lx0.480W 71.12mmx12.19mm
JESD-609 Code e0
Part Status Active
Moisture Sensitivity Level (MSL) 1 (Unlimited)
Termination Solder
ECCN Code EAR99
Number of Positions 28Positions
Max Operating Temperature 105°C
Min Operating Temperature -55°C
Number of Rows 2Rows
Additional Feature SOCKET ADAPTER
Pitch 0.050 1.27mm
Number of Contacts 28Contacts
Row Spacing 15.24 mm
Device Socket Type IC SOCKET
Proto Board Type SMD to DIP
Height 1.58mm
Board Thickness 0.062 1.57mm 1/16
RoHS Status Non-RoHS Compliant
Lead Free Contains Lead
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28-650000-10 Documents

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