Aries Electronics 18-350000-10 Adapter & Breakout Boards FR4 Epoxy Glass 18Positions SOIC 1.800Lx0.450W 45.72mmx11.43mm
18-350000-10
196-719-18-350000-10
RoHS Compliant
Material: FR4 Epoxy Glass,Number of Positions: 18Positions,Board Thickness: 0.062 1.57mm 1/16,Package Accepted: SOIC,Size / Dimension: 1.800Lx0.450W 45.72mmx11.43mm
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18-350000-10 Tech Specifications
Aries Electronics 18-350000-10 technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.
| Factory Lead Time | 5 Weeks | |
| Contact Plating | Tin | |
| Material | FR4 Epoxy Glass | |
| Package Accepted | SOIC | |
| Contact Materials | Brass | |
| Series | Correct-A-Chip® 350000 | |
| Published | 2006 | |
| Size / Dimension | 1.800Lx0.450W 45.72mmx11.43mm | |
| JESD-609 Code | e0 | |
| Part Status | Active | |
| Moisture Sensitivity Level (MSL) | 1 (Unlimited) | |
| Termination | Solder | |
| ECCN Code | EAR99 | |
| Number of Positions | 18Positions | |
| Max Operating Temperature | 105°C | |
| Min Operating Temperature | -55°C | |
| Number of Rows | 2Rows | |
| Additional Feature | SOCKET ADAPTER | |
| Pitch | 0.050 1.27mm | |
| Number of Contacts | 18Contacts | |
| Row Spacing | 7.62 mm | |
| Device Socket Type | IC SOCKET | |
| Proto Board Type | SMD to DIP | |
| Height | 1.58mm | |
| Board Thickness | 0.062 1.57mm 1/16 | |
| RoHS Status | Non-RoHS Compliant | |
| Lead Free | Contains Lead |
18-350000-10 Documents
Download datasheets and manufacturer documentation for 18-350000-10
- Datasheets350000-1x(-P) Series
- Other Related DocumentsCustom Correct-A-Chip? Adapters
- Environmental InformationAreies Electronics RoHS 3 Cert
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