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HMC850LC3 Tech Specifications

Analog Devices Inc.  HMC850LC3 technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.

Lifecycle Status PRODUCTION (Last Updated: 1 week ago)
Factory Lead Time 8 Weeks
Mount Surface Mount
Mounting Type Surface Mount
Package / Case 16-VFCQFN Exposed Pad
Number of Pins 16Pins
Frequency(Max) 20GHz
Operating Temperature -40°C~85°C
Packaging Strip
JESD-609 Code e4
Pbfree Code no
Part Status Active
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Number of Terminations 16Terminations
ECCN Code EAR99
Type Fanout Buffer (Distribution)
Terminal Finish GOLD (80) OVER NICKEL (50)
Max Power Dissipation 680mW
Voltage - Supply -3V~-3.6V
Terminal Position QUAD
Terminal Form NO LEAD
Peak Reflow Temperature (Cel) NOT SPECIFIED
Number of Functions 1Function
Terminal Pitch 0.5mm
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
Base Part Number HMC850
Pin Count 16
Polarity Non-Inverting
Number of Circuits 1Circuit
Operating Supply Current 95mA
Propagation Delay 75 ps
Family 850
Data Rate 28 Gbps
Input CML
Ratio - Input:Output 1:2
Differential - Input:Output Yes/Yes
Number of Output Lines 2Output Lines
Length 3mm
Width 3mm
RoHS Status ROHS3 Compliant
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HMC850LC3 Documents

Download datasheets and manufacturer documentation for   HMC850LC3

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