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HMC326MS8GE Tech Specifications

Analog Devices Inc.  HMC326MS8GE technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.

Lifecycle Status PRODUCTION (Last Updated: 1 week ago)
Factory Lead Time 20 Weeks
Contact Plating Tin
Mount Surface Mount
Mounting Type Surface Mount
Package / Case 8-TSSOP, 8-MSOP (0.118, 3.00mm Width) Exposed Pad
Number of Pins 8Pins
Weight 139.989945mg
Packaging Strip
JESD-609 Code e3
Pbfree Code no
Part Status Active
Moisture Sensitivity Level (MSL) 1 (Unlimited)
Number of Terminations 8Terminations
ECCN Code EAR99
Max Operating Temperature 85°C
Min Operating Temperature -40°C
Max Power Dissipation 916mW
Voltage - Supply 5V
Number of Functions 1Function
Construction COMPONENT
Frequency 3GHz~4.5GHz
Base Part Number HMC326
Pin Count 8
Power Supplies 5V
Number of Channels 1Channel
Operating Supply Current 130mA
Nominal Supply Current 130mA
Gain 21dB
RF/Microwave Device Type WIDE BAND MEDIUM POWER
RF Type General Purpose
Characteristic Impedance 50Ohm
Max Junction Temperature (Tj) 150°C
Noise Figure 5dB
P1dB 23.5dBm
Height 1.1mm
Length 3.1mm
Width 3.1mm
REACH SVHC No SVHC
RoHS Status ROHS3 Compliant
Lead Free Contains Lead
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HMC326MS8GE Documents

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