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AD8316ACP-REEL7 Tech Specifications

Analog Devices Inc.  AD8316ACP-REEL7 technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.

Package / Case 16-VFQFN Exposed Pad, CSP
Surface Mount YES
Supplier Device Package 16-LFCSP-VQ (3x3)
Number of Terminals 16Terminals
Mfr Analog Devices Inc.
Package Bulk
Product Status Active
RoHS Compliant
Package Description HVQCCN,
Package Style CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
Moisture Sensitivity Levels NOT APPLICABLE
Package Body Material UNSPECIFIED
Operating Temperature-Min -30 °C
Supply Voltage-Nom 2.7 V
Reflow Temperature-Max (s) 30
Operating Temperature-Max 85 °C
Rohs Code No
Manufacturer Part Number AD8316ACP-REEL7
Package Code HVQCCN
Package Shape SQUARE
Manufacturer Rochester Electronics LLC
Part Life Cycle Code Active
Ihs Manufacturer ROCHESTER ELECTRONICS INC
Risk Rank 5.71
Part Package Code QFN
Series -
Packaging Tape & Reel
JESD-609 Code e0
Pbfree Code No
Terminal Finish TIN LEAD
Max Operating Temperature 85 °C
Min Operating Temperature -30 °C
Terminal Position QUAD
Terminal Form NO LEAD
Peak Reflow Temperature (Cel) 220
Number of Functions 1Function
Terminal Pitch 0.65 mm
Reach Compliance Code unknown
Frequency 100MHz ~ 2.5GHz
Pin Count 16
JESD-30 Code S-XQCC-N16
Qualification Status COMMERCIAL
Temperature Grade OTHER
Seated Height-Max 1 mm
Telecom IC Type TELECOM CIRCUIT
RF Type DCS, EDGE, GSM, PCS
Features -
Width 4 mm
Length 4 mm
Radiation Hardening No
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AD8316ACP-REEL7 Documents

Download datasheets and manufacturer documentation for   AD8316ACP-REEL7

  • Datasheets
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