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LTP5900IPC-WHMA1B2#PBF Tech Specifications

Analog Devices  LTP5900IPC-WHMA1B2#PBF technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.

Mounting Type Through Hole
Package / Case 22-DIP Module
Housing Material Liquid Crystal Polymer (LCP)
Number of Positions or Pins (Grid) 370 (19 x 19)
Contact Material - Mating Copper Alloy
Contact Material - Post Copper Alloy
Contact Finish Mating Gold
Maximum Operating Temperature + 85 C
Supply Voltage-Max 3.76 V
Unit Weight 0.457785 oz
Minimum Operating Temperature - 40 C
Factory Pack QuantityFactory Pack Quantity 1
Supply Voltage-Min 2.75 V
Interface Type SPI, UART
Manufacturer Analog Devices Inc.
Brand Analog Devices
Processor Type ARM Cortex M3
RoHS Details
Package Box
Base Product Number LTP5900
Mfr Analog Devices Inc.
Product Status Active
Operating Temperature --
Series --
Packaging Tray
Part Status Obsolete
Termination Solder
Type PGA, ZIF (ZIP)
Subcategory Ethernet & Communication Modules
Voltage - Supply 2.75V ~ 3.76V
Frequency 2.4 GHz to 2.484 GHz
Pitch - Mating 0.100 (2.54mm)
Contact Finish - Post Gold
Contact Resistance --
Memory Size -
Number of Ports -Port
Data Rate 250 kb/s
Utilized IC / Part -
Product Type Networking Modules
Protocol WirelessHART
Power - Output 8dBm
Termination Post Length 0.093 (2.36mm)
Pitch - Post 0.100 (2.54mm)
RF Family/Standard 802.15.4
Antenna Type Antenna Not Included, MMCX
Sensitivity -95dBm
Serial Interfaces SPI, UART
Current - Receiving 4.5mA
Current - Transmitting 5.4mA ~ 9.7mA
Modulation DSSS
Product Wireless Sensor Networks
Features Open Frame
Product Category Networking Modules
Contact Finish Thickness - Mating 30.0µin (0.76µm)
Contact Finish Thickness - Post 30.0µin (0.76µm)
Material Flammability Rating UL94 V-0
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LTP5900IPC-WHMA1B2#PBF Documents

Download datasheets and manufacturer documentation for   LTP5900IPC-WHMA1B2#PBF

  • Datasheets
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