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ADXRS624WBBGZ Tech Specifications
AnalogDevices ADXRS624WBBGZ technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.
| Contact Plating | Lead, Tin | |
| Surface Mount | YES | |
| Number of Pins | 32Pins | |
| Number of Terminals | 32Terminals | |
| RoHS | Compliant | |
| Package Description | BGA-32 | |
| Package Style | GRID ARRAY, FINE PITCH | |
| Package Body Material | CERAMIC, METAL-SEALED COFIRED | |
| Package Equivalence Code | BGA32,7X7,32 | |
| Manufacturer Package Code | BG-32-3 | |
| Operating Temperature-Min | -40 °C | |
| Reflow Temperature-Max (s) | 40 | |
| Operating Temperature-Max | 105 °C | |
| Rohs Code | Yes | |
| Manufacturer Part Number | ADXRS624WBBGZ | |
| Supply Voltage-Nom (Vsup) | 5 V | |
| Package Code | FBGA | |
| Package Shape | SQUARE | |
| Manufacturer | Analog Devices Inc | |
| Part Life Cycle Code | Obsolete | |
| Ihs Manufacturer | ANALOG DEVICES INC | |
| Risk Rank | 5.08 | |
| Part Package Code | BGA | |
| Pbfree Code | No | |
| ECCN Code | 7A994 | |
| Max Operating Temperature | 105 °C | |
| Min Operating Temperature | -40 °C | |
| HTS Code | 8542.39.00.01 | |
| Subcategory | Other Analog ICs | |
| Technology | BIMOS | |
| Terminal Position | BOTTOM | |
| Terminal Form | BALL | |
| Peak Reflow Temperature (Cel) | 260 | |
| Number of Functions | 1Function | |
| Terminal Pitch | 0.8 mm | |
| Reach Compliance Code | unknown | |
| Pin Count | 32 | |
| JESD-30 Code | S-CBGA-B32 | |
| Qualification Status | Not Qualified | |
| Output Type | Analog | |
| Supply Voltage-Max (Vsup) | 5.25 V | |
| Power Supplies | 5 V | |
| Temperature Grade | INDUSTRIAL | |
| Supply Voltage-Min (Vsup) | 4.75 V | |
| Max Supply Voltage | 5.25 V | |
| Min Supply Voltage | 4.75 V | |
| Analog IC - Other Type | ANALOG CIRCUIT | |
| Operating Supply Current | 3.5 mA | |
| Nominal Supply Current | 3.5 mA | |
| Seated Height-Max | 3.8 mm | |
| -3db Bandwidth | 1 kHz | |
| Width | 6.85 mm | |
| Length | 6.85 mm | |
| Lead Free | Contains Lead |
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