Analog Devices 1701177 Wire-to-Board Connectors Bulk
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1701177 Tech Specifications
Analog Devices 1701177 technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.
| Mounting Type | Through Hole, Right Angle | |
| Contact Shape | Square | |
| Voltage, Rating | -- | |
| Mated Stacking Heights | -- | |
| Contact Materials | Copper Alloy | |
| Contact Finish Mating | Gold | |
| Insulation Materials | Thermoplastic | |
| Contact Length-Mating | 0.318 (8.08mm) | |
| Operating Temperature | -65°C ~ 105°C | |
| Series | AMPMODU Mod II | |
| Packaging | Bulk | |
| Part Status | Discontinued at Digi-Key | |
| Termination | Solder | |
| Connector Type | Header, Breakaway | |
| Number of Positions | 10Positions | |
| Applications | -- | |
| Number of Rows | 1Row | |
| Fastening Type | Push-Pull | |
| Contact Type | Male Pin | |
| Ingress Protection | -- | |
| Insulation Height | 0.138 (3.50mm) | |
| Style | Board to Board or Cable | |
| Number of Positions Loaded | All | |
| Current Rating | 3A | |
| Pitch - Mating | 0.100 (2.54mm) | |
| Insulation Color | Black | |
| Row Spacing - Mating | -- | |
| Contact Length - Post | 0.110 (2.79mm) | |
| Shrouding | Unshrouded | |
| Contact Finish - Post | Tin-Lead | |
| Overall Contact Length | -- | |
| Features | -- | |
| Contact Finish Thickness - Mating | 30.0µin (0.76µm) | |
| Contact Finish Thickness - Post | 100.0µin (2.54µm) | |
| Material Flammability Rating | UL94 V-0 |
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