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SFW4S-2STE1LF Tech Specifications
Amphenol SFW4S-2STE1LF technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.
| Factory Lead Time | 11 Weeks | |
| Contact Plating | Tin | |
| Mount | Surface Mount | |
| Mounting Type | Surface Mount | |
| Housing Material | Thermoplastic, Glass Filled | |
| Actuator Material | Thermoplastic, Glass Filled | |
| ActuatorColor | Black | |
| Contact Materials | Phosphor Bronze | |
| Voltage Rated | 100V | |
| Operating Temperature | -55°C~105°C | |
| Packaging | Tape & Reel (TR) | |
| Series | SFW | |
| Published | 2013 | |
| Part Status | Active | |
| Moisture Sensitivity Level (MSL) | 1 (Unlimited) | |
| Termination | Solder | |
| Number of Positions | 4Positions | |
| Max Operating Temperature | 85°C | |
| Min Operating Temperature | -55°C | |
| Number of Rows | 1Row | |
| Gender | Receptacle | |
| Current Rating (Amps) | 1A | |
| Pitch | 0.039 1.00mm | |
| Orientation | Straight | |
| Depth | 3.6mm | |
| Current Rating | 1A | |
| Contact Finish | Tin | |
| Voltage - Rated AC | 100V | |
| Number of Contacts | 4Contacts | |
| Housing Color | Brown | |
| Contact Resistance | 30mOhm | |
| Insulation Resistance | 500MOhm | |
| Max Voltage Rating (AC) | 100V | |
| Wire/Cable Type | Straight | |
| Max Voltage Rating (DC) | 100V | |
| Mating Cycles | 20 | |
| Flat Flex Type | FFC, FPC | |
| Cable End Type | Straight, Tapered | |
| Locking Feature | Slide Lock | |
| Contact Location | Bottom | |
| Features | Zero Insertion Force (ZIF) | |
| Length | 9.8mm | |
| Width | 3.6mm | |
| Height Above Board | 0.209 5.30mm | |
| FFC, FCB Thickness | 0.30mm 0.33mm | |
| Material Flammability Rating | UL94 V-0 | |
| REACH SVHC | No SVHC | |
| Radiation Hardening | No | |
| RoHS Status | RoHS Compliant | |
| Flammability Rating | UL94 V-0 | |
| Lead Free | Lead Free |
SFW4S-2STE1LF Documents
Download datasheets and manufacturer documentation for SFW4S-2STE1LF
- PCN Assembly/OriginFFC/FPC series 20/Jul/2011
- PCN PackagingMultiple Devices Packaging Material 31/Jan/2019 Multiple Devices Package Material Revision 25/Feb/2019
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