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10067099-200LF Tech Specifications
Amphenol 10067099-200LF technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.
| Factory Lead Time | 13 Weeks | |
| Contact Plating | Gold | |
| Mount | Surface Mount | |
| Mounting Type | Surface Mount, Right Angle | |
| Mounting Feature | Normal, Standard - Top | |
| Housing Material | Polymer | |
| Packaging | Tape & Reel (TR) | |
| Published | 2011 | |
| Part Status | Active | |
| Moisture Sensitivity Level (MSL) | 1 (Unlimited) | |
| Termination | Solder | |
| Connector Type | Connector | |
| Number of Positions | 10 (8 + 2)Position | |
| Max Operating Temperature | 85°C | |
| Min Operating Temperature | -40°C | |
| Number of Rows | 2Rows | |
| Orientation | Right Angle | |
| Depth | 5.5mm | |
| Contact Finish | Gold | |
| Card Type | microSD™ | |
| Insertion, Removal Method | Push In, Pull Out | |
| Length | 11.4mm | |
| Contact Finish Thickness | 30.0μin 0.76μm | |
| Height Above Board | 0.104 2.65mm | |
| Radiation Hardening | No | |
| RoHS Status | RoHS Compliant |
10067099-200LF Documents
Download datasheets and manufacturer documentation for 10067099-200LF
- PCN Assembly/OriginAFCI Assembly Process Transfer 15/Apr/2016
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