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10018783-10200TLF Tech Specifications

Amphenol  10018783-10200TLF technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.

Factory Lead Time 9 Weeks
Contact Plating Gold
Mount Through Hole
Mounting Type Through Hole
Housing Material Nylon
Material - Insulation Polyamide (PA), Nylon, Glass Filled
Contact Materials Copper Alloy
Operating Temperature -55°C~85°C
Packaging Tray
Series HPCE®
Published 2008
Part Status Active
Moisture Sensitivity Level (MSL) 1 (Unlimited)
Termination Solder, Staggered
Connector Type Cantilever
Number of Positions 36Positions
Max Operating Temperature 85°C
Min Operating Temperature -55°C
Color Black
Number of Rows 2Rows
Gender Female
Contact Type Cantilever
Pitch 0.039 1.00mm
Orientation Straight
Current Rating 1.1A
Contact Finish Gold
Voltage - Rated AC 300V
Number of Contacts 36Contacts
Housing Color Black
Contact Resistance 30mOhm
Card Type PCI Express™
Read Out Dual
Insulation Resistance 1GOhm
Max Voltage Rating (AC) 300V
Features Board Guide, Locking Ramp
Length 25mm
Width 7.4mm
Contact Finish Thickness Flash
Card Thickness 0.062 1.57mm
Board Thickness 1.56mm
REACH SVHC No SVHC
RoHS Status RoHS Compliant
Flammability Rating UL94 V-0
Lead Free Lead Free
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10018783-10200TLF Documents

Download datasheets and manufacturer documentation for   10018783-10200TLF

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