Amphenol FCi DIP-308-014BLF Sockets for ICs & Transistors 8Contacts
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DIP-308-014BLF Tech Specifications
Amphenol DIP-308-014BLF technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.
| Housing Material | GLASS FILLED POLYCYCLOHEXYDIMETHYLENE TEREPHTHALATE-POLYESTER | |
| Rohs Code | Yes | |
| Part Life Cycle Code | Obsolete | |
| Ihs Manufacturer | FCI | |
| Package Description | LEAD FREE | |
| Body Length | 0.3 inch | |
| Contact Finish Mating | TIN (100) OVER NICKEL | |
| Contact Materials | BE-CU | |
| Mounting Styles | STRAIGHT | |
| JESD-609 Code | e3 | |
| ECCN Code | EAR99 | |
| HTS Code | 8536.69.40.40 | |
| Terminal Pitch | 2.54 mm | |
| Reach Compliance Code | compliant | |
| Number of Contacts | 8Contacts | |
| PCB Contact Pattern | RECTANGULAR | |
| Body Breadth | 0.4 inch | |
| Body Depth | 0.165 inch | |
| Contact Style | RND PIN-SKT | |
| Mating Contact Pitch | 0.1 inch | |
| Termination Type | SOLDER | |
| PCB Contact Row Spacing | 0.30000000000000004 mm | |
| Contact Finish Termination | TIN OVER NICKEL | |
| Device Socket Type | IC SOCKET | |
| Device Type Used On | DIP8 |
DIP-308-014BLF Documents
Download datasheets and manufacturer documentation for DIP-308-014BLF
- DatasheetsFRCIS62838-1.pdf
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