DIP308-011BLF Tech Specifications

Amphenol  DIP308-011BLF technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.

Contact Plating Gold
Housing Material GLASS FILLED POLYCYCLOHEXYDIMETHYLENE TEREPHTHALATE-POLYESTER
Number of Terminals 3Terminals
Body Orientation Straight
Voltage, Rating 600VAC
Product Depth (mm) Not Required(mm)
Shell Size / Insert Arrangement 9-98
Operating Temp Range -65C to 175C
Termination Method Crimp
Product Diameter (mm) 21.79(mm)
Mounting Styles Cable
Rad Hardened No
Contact Classification 3Signal
Package Description LEAD FREE
Contact Finish Mating GOLD (10) OVER NICKEL (50)
Body Length 0.3 inch
Rohs Code Yes
Manufacturer Part Number DIP-308-011BLF
Contact Materials BERYLLIUM COPPER
Manufacturer Amphenol FCi
Part Life Cycle Code Obsolete
Ihs Manufacturer FCI
Risk Rank 5.64
Manufacturer Series DIP
JESD-609 Code e4
Pbfree Code Yes
ECCN Code EAR99
Type Circular
Gender PL
HTS Code 8536.69.40.40
Terminal Pitch 2.54 mm
Reach Compliance Code compliant
Number of Contacts 3(POS)Contact
PCB Contact Pattern RECTANGULAR
Body Breadth 0.4 inch
Contact Gender PIN
Body Depth 0.165 inch
Contact Style RND PIN-SKT
Mating Contact Pitch 0.1 inch
Termination Type SOLDER
Number of Ports 1(Port)Port
PCB Contact Row Spacing 0.3 mm
Contact Finish Termination GOLD (10) OVER NICKEL (50)
Family D38999
Device Socket Type IC SOCKET
Shell Plating Cadmium
Device Type Used On DIP8
Strain Relief No
Product Height (mm) Not Required(mm)
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