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DILB20P223T Tech Specifications

Amphenol  DILB20P223T technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.

Mounting Type Through Hole
Material - Insulation --
Mounting Hole Diameter 0.070 ~ 0.077 (1.78mm ~ 1.96mm)
Length Below Flange --
Contact Materials Brass
Length Above Flange --
Body Orientation Straight
Termination Method Solder
Base/Housing Material Polyamide
Mounting Through Hole
Series AMPMODU
Packaging Reel
Operating Temperature -55 to 105 °C
Part Status Obsolete
Termination Press-Fit
Type DIP Socket
Number of Rows 2Rows
Gender Receptacle
Pitch 2.5400 mm
Insulation Color --
Pin Count 20
Contact Finish Tin
Number of Contacts 20 POSContact
Row Spacing 7.62 mm
Insulation Non-Insulated
Terminal Type Single Post
Flange Diameter --
Terminal Style Pin Retention
Pin Size - Above Flange 0.045 (1.14mm) Square
Pin Size - Below Flange 0.045 (1.14mm) Square
Product Length 25.4 mm
Contact Finish Thickness 100.0µin (2.54µm)
Length - Overall 0.400 (10.16mm)
Board Thickness 0.100 (2.54mm)
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