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QED234A4R0 Tech Specifications
AMI Semiconductor QED234A4R0 technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.
| Mounting Type | Through Hole | |
| Package / Case | Radial, 5mm Dia (T 1 3/4) | |
| Material | Elastomer | |
| Shape | Square | |
| Package | Bulk | |
| Mfr | Laird Technologies - Thermal Materials | |
| Product Status | Obsolete | |
| Lead Free Status / RoHS Status | Lead free / RoHS Compliant | |
| Series | Tflex™ XS400 | |
| Operating Temperature | -40°C ~ 100°C (TA) | |
| Packaging | Tape & Reel (TR) | |
| Moisture Sensitivity Level (MSL) | 1 (Unlimited) | |
| Type | Gap Filler Pad, Sheet | |
| Color | Gray | |
| Orientation | Top View | |
| Voltage - Forward (Vf) (Typ) | 1.6V | |
| Viewing Angle | 40° | |
| Usage | - | |
| Shelf Life | - | |
| Adhesive | Tacky - One Side | |
| Storage/Refrigeration Temperature | - | |
| Shelf Life Start | - | |
| Backing, Carrier | - | |
| Wavelength | 940nm | |
| Outline | 228.60mm x 228.60mm | |
| Current - DC Forward (If) (Max) | 100mA | |
| Thermal Conductivity | 2.0W/m-K | |
| Radiant Intensity (Ie) Min @ If | 27mW/sr @ 100mA | |
| Thermal Resistivity | - | |
| Thickness | 0.0700 (1.778mm) |
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