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HLMP-D150 Tech Specifications

AMI Semiconductor  HLMP-D150 technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.

Package / Case 1206 (3216 Metric)
Supplier Device Package 1206
Package Tape & Reel (TR);Cut Tape (CT);Digi-Reel®;
Base Product Number RN73H2B
Mfr KOA Speer Electronics, Inc.
Product Status Active
Lead Free Status / RoHS Status Lead free / RoHS Compliant
Operating Temperature -55°C ~ 155°C
Series RN73H
Size / Dimension 0.126 L x 0.063 W (3.20mm x 1.60mm)
Tolerance ±0.5%
Moisture Sensitivity Level (MSL) 1 (Unlimited)
Number of Terminations 2Terminations
Temperature Coefficient ±25ppm/°C
Resistance 15.2 Ohms
Composition Metal Film
Power (Watts) 0.25W, 1/4W
Failure Rate -
Features Automotive AEC-Q200, Moisture Resistant
Height Seated (Max) 0.028 (0.70mm)
Ratings AEC-Q200
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