HLMP3300 Tech Specifications

AMI Semiconductor  HLMP3300 technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.

Mounting Type Free Hanging (In-Line)
Package / Case Radial
Mounting Feature -
Shell Material Composite
Supplier Device Package T-1 3/4
Insert Material Thermoplastic
Backshell Material, Plating -
Voltage, Rating 600VAC, 850VDC
Package Bag
Primary Material Composite
Base Product Number ACT26JD
Mfr TE Connectivity Deutsch Connectors
Product Status Active
Contact Materials Copper Alloy
Contact Finish Mating Gold
Lead Free Status / RoHS Status Lead free / RoHS Compliant
Other Names HLMP-3300 HLMP-3300QT HLMP-3300QT-ND
Wavelength-dominant -
Operating Temperature -65°C ~ 175°C
Series MIL-DTL-38999 Series III, ACT
Packaging Bulk
Size / Dimension -
Moisture Sensitivity Level (MSL) 1 (Unlimited)
Termination Crimp
Connector Type Plug, Male Pins
Number of Positions 19Positions
Color Olive Drab
Applications Aviation, Communication Systems, Industrial
Fastening Type Threaded
Current Rating (Amps) -
Orientation A
Shielding Shielded
Ingress Protection Environment Resistant
Base Part Number HLMP3300
Shell Finish Olive Drab Cadmium
Shell Size - Insert 15-19
Configuration Standard
Shell Size, MIL D
Voltage - Forward (Vf) (Typ) 2.2V
Viewing Angle 65°
Cable Opening -
Current - Test 10mA
Millicandela Rating 3.5mcd
Lens Transparency Diffused
Wavelength - Peak 635nm
Lens Color Red
Features Coupling Nut
Lens Style/Size Round with Domed Top, 5mm (T-1 3/4), 4.83mm
Contact Finish Thickness - Mating 50.0µin (1.27µm)
Height (Max) 8.89mm
Material Flammability Rating -
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