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XQ7Z030-1RF900Q Tech Specifications

Xilinx  XQ7Z030-1RF900Q technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.

Surface Mount YES
Number of Terminals 900Terminals
Rohs Code No
Part Life Cycle Code Transferred
Ihs Manufacturer XILINX INC
Package Description 31 X 31 MM, 1 MM PITCH, BGA-900
Operating Temperature-Max 125 °C
Operating Temperature-Min -40 °C
Package Body Material PLASTIC/EPOXY
Package Code BGA
Package Equivalence Code BGA900,30X30,40
Package Shape SQUARE
Package Style GRID ARRAY
JESD-609 Code e0
Terminal Finish TIN LEAD
HTS Code 8542.31.00.01
Terminal Position BOTTOM
Terminal Form BALL
Terminal Pitch 1 mm
Reach Compliance Code not_compliant
JESD-30 Code S-PBGA-B900
Qualification Status Not Qualified
Temperature Grade AUTOMOTIVE
uPs/uCs/Peripheral ICs Type PROGRAMMABLE SoC
Seated Height-Max 3.44 mm
Length 31 mm
Width 31 mm
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XQ7Z030-1RF900Q Documents

Download datasheets and manufacturer documentation for   XQ7Z030-1RF900Q

XQ7Z030-1RF900Q brand manufacturers: AMD Xilinx, Twicea stock, XQ7Z030-1RF900Q reference price.AMD Xilinx. XQ7Z030-1RF900Q parameters, XQ7Z030-1RF900Q Datasheet PDF and pin diagram description download.You can use the XQ7Z030-1RF900Q Embedded - Microcontrollers - Application Specific, DSP Datesheet PDF, find XQ7Z030-1RF900Q pin diagram and circuit diagram and usage method of function,XQ7Z030-1RF900Q electronics tutorials.You can download from the Twicea.