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XCZU7EG-3FBVB900I Tech Specifications

Xilinx  XCZU7EG-3FBVB900I technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.

Surface Mount YES
Number of Terminals 900Terminals
Rohs Code Yes
Part Life Cycle Code Transferred
Ihs Manufacturer XILINX INC
Package Description BGA,
Date Of Intro 2017-02-15
Moisture Sensitivity Levels 4
Operating Temperature-Max 100 °C
Operating Temperature-Min -40 °C
Package Body Material PLASTIC/EPOXY
Package Code BGA
Package Shape SQUARE
Package Style GRID ARRAY
Supply Voltage-Nom 0.9 V
JESD-609 Code e1
Terminal Finish Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)
HTS Code 8542.31.00.01
Terminal Position BOTTOM
Terminal Form BALL
Peak Reflow Temperature (Cel) 245
Terminal Pitch 1 mm
Reach Compliance Code compliant
Time@Peak Reflow Temperature-Max (s) 30
JESD-30 Code S-PBGA-B900
Temperature Grade INDUSTRIAL
uPs/uCs/Peripheral ICs Type PROGRAMMABLE SoC
Seated Height-Max 2.97 mm
Length 31 mm
Width 31 mm
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XCZU7EG-3FBVB900I Documents

Download datasheets and manufacturer documentation for   XCZU7EG-3FBVB900I

  • Datasheets
XCZU7EG-3FBVB900I brand manufacturers: AMD Xilinx, Twicea stock, XCZU7EG-3FBVB900I reference price.AMD Xilinx. XCZU7EG-3FBVB900I parameters, XCZU7EG-3FBVB900I Datasheet PDF and pin diagram description download.You can use the XCZU7EG-3FBVB900I Embedded - Microcontrollers - Application Specific, DSP Datesheet PDF, find XCZU7EG-3FBVB900I pin diagram and circuit diagram and usage method of function,XCZU7EG-3FBVB900I electronics tutorials.You can download from the Twicea.