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XCZU6CG-1SFVA625E Tech Specifications

Xilinx  XCZU6CG-1SFVA625E technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.

Surface Mount YES
Number of Terminals 625Terminals
Rohs Code Yes
Part Life Cycle Code Transferred
Ihs Manufacturer XILINX INC
Package Description FBGA, BGA625,25X25,32
Operating Temperature-Max 100 °C
Package Body Material PLASTIC/EPOXY
Package Code FBGA
Package Equivalence Code BGA625,25X25,32
Package Shape SQUARE
Package Style GRID ARRAY, FINE PITCH
Supply Voltage-Max 0.876 V
Supply Voltage-Min 0.825 V
Supply Voltage-Nom 0.85 V
HTS Code 8542.31.00.01
Terminal Position BOTTOM
Terminal Form BALL
Terminal Pitch 0.8 mm
Reach Compliance Code unknown
JESD-30 Code S-PBGA-B625
Temperature Grade OTHER
uPs/uCs/Peripheral ICs Type PROGRAMMABLE SoC
Seated Height-Max 3.43 mm
Bus Compatibility I2C(2), PCI, SATA, SGMII, SPI(2), UART(2), USB(2)
Length 21 mm
Width 21 mm
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XCZU6CG-1SFVA625E Documents

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