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XCZU3EG-3SFVA625E Tech Specifications

Xilinx  XCZU3EG-3SFVA625E technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.

Surface Mount YES
Number of Terminals 625Terminals
Rohs Code Yes
Part Life Cycle Code Transferred
Ihs Manufacturer XILINX INC
Package Description BGA,
Moisture Sensitivity Levels 4
Operating Temperature-Max 100 °C
Package Body Material PLASTIC/EPOXY
Package Code BGA
Package Shape SQUARE
Package Style GRID ARRAY
Supply Voltage-Nom 0.9 V
JESD-609 Code e1
Terminal Finish TIN SILVER COPPER
HTS Code 8542.31.00.01
Terminal Position BOTTOM
Terminal Form BALL
Reach Compliance Code compliant
JESD-30 Code S-PBGA-B625
Temperature Grade OTHER
uPs/uCs/Peripheral ICs Type PROGRAMMABLE SoC
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XCZU3EG-3SFVA625E Documents

Download datasheets and manufacturer documentation for   XCZU3EG-3SFVA625E

  • Datasheets
XCZU3EG-3SFVA625E brand manufacturers: AMD Xilinx, Twicea stock, XCZU3EG-3SFVA625E reference price.AMD Xilinx. XCZU3EG-3SFVA625E parameters, XCZU3EG-3SFVA625E Datasheet PDF and pin diagram description download.You can use the XCZU3EG-3SFVA625E Embedded - Microcontrollers - Application Specific, DSP Datesheet PDF, find XCZU3EG-3SFVA625E pin diagram and circuit diagram and usage method of function,XCZU3EG-3SFVA625E electronics tutorials.You can download from the Twicea.