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XCR3320-10BG256C Tech Specifications

Xilinx  XCR3320-10BG256C technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.

Surface Mount YES
Number of Terminals 256Terminals
Rohs Code No
Part Life Cycle Code Obsolete
Ihs Manufacturer XILINX INC
Part Package Code BGA
Package Description PLASTIC, BGA-256
Clock Frequency-Max 87 MHz
Moisture Sensitivity Levels 3
Number of I/O Lines 3I/O Lines
Operating Temperature-Max 70 °C
Package Body Material PLASTIC/EPOXY
Package Code BGA
Package Equivalence Code BGA256,20X20,50
Package Shape SQUARE
Package Style GRID ARRAY
Supply Voltage-Max 3.6 V
Supply Voltage-Min 3 V
Supply Voltage-Nom 3.3 V
JESD-609 Code e0
Terminal Finish TIN LEAD
Additional Feature YES
HTS Code 8542.39.00.01
Terminal Position BOTTOM
Terminal Form BALL
Peak Reflow Temperature (Cel) 225
Terminal Pitch 1.27 mm
Reach Compliance Code not_compliant
Time@Peak Reflow Temperature-Max (s) 30
Pin Count 256
JESD-30 Code S-PBGA-B256
Qualification Status Not Qualified
Temperature Grade COMMERCIAL
Propagation Delay 10 ns
Organization 12 DEDICATED INPUTS, 3 I/O
Seated Height-Max 2.55 mm
Programmable Logic Type LOADABLE PLD
Output Function MACROCELL
Number of Macro Cells 320Macro Cells
JTAG BST YES
Number of Dedicated Inputs 12Dedicated Inputs
In-System Programmable YES
Length 27 mm
Width 27 mm
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XCR3320-10BG256C Documents

Download datasheets and manufacturer documentation for   XCR3320-10BG256C

  • Datasheets
XCR3320-10BG256C brand manufacturers: AMD Xilinx, Twicea stock, XCR3320-10BG256C reference price.AMD Xilinx. XCR3320-10BG256C parameters, XCR3320-10BG256C Datasheet PDF and pin diagram description download.You can use the XCR3320-10BG256C Embedded - PLDs (Programmable Logic Device), DSP Datesheet PDF, find XCR3320-10BG256C pin diagram and circuit diagram and usage method of function,XCR3320-10BG256C electronics tutorials.You can download from the Twicea.