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XC17S200XLSOG20C Tech Specifications

Xilinx  XC17S200XLSOG20C technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.

Surface Mount YES
Number of Terminals 20Terminals
Rohs Code Yes
Part Life Cycle Code Obsolete
Ihs Manufacturer XILINX INC
Part Package Code SOIC
Package Description SOP,
Moisture Sensitivity Levels 3
Number of Words 1335872 wordsWord
Number of Words Code 1335872Words Codes
Operating Temperature-Max 70 °C
Package Body Material PLASTIC/EPOXY
Package Code SOP
Package Shape RECTANGULAR
Package Style SMALL OUTLINE
Supply Voltage-Nom (Vsup) 3.3 V
JESD-609 Code e3
Pbfree Code Yes
ECCN Code 3A991.B.1.B.1
Terminal Finish Matte Tin (Sn)
HTS Code 8542.32.00.51
Terminal Position DUAL
Terminal Form GULL WING
Peak Reflow Temperature (Cel) 260
Number of Functions 1Function
Terminal Pitch 1.27 mm
Reach Compliance Code compliant
Time@Peak Reflow Temperature-Max (s) 30
Pin Count 20
JESD-30 Code R-PDSO-G20
Qualification Status Not Qualified
Supply Voltage-Max (Vsup) 3.6 V
Temperature Grade COMMERCIAL
Supply Voltage-Min (Vsup) 3 V
Operating Mode SYNCHRONOUS
Organization 1335872X1
Seated Height-Max 2.65 mm
Memory Width 1
Memory Density 1335872 bit
Parallel/Serial SERIAL
Memory IC Type CONFIGURATION MEMORY
Length 12.8 mm
Width 7.5 mm
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XC17S200XLSOG20C Documents

Download datasheets and manufacturer documentation for   XC17S200XLSOG20C

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