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- XC17S200XLPD8C
AMD Xilinx XC17S200XLPD8C Memory ICs
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XC17S200XLPD8C Tech Specifications
Xilinx XC17S200XLPD8C technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.
| Surface Mount | NO | |
| Number of Terminals | 8Terminals | |
| Supply Voltage-Nom (Vsup) | 3.3 V | |
| Package Style | IN-LINE | |
| Package Shape | RECTANGULAR | |
| Package Code | DIP | |
| Package Body Material | PLASTIC/EPOXY | |
| Operating Temperature-Max | 70 °C | |
| Number of Words Code | 1335872Words Codes | |
| Number of Words | 1335872 wordsWord | |
| Moisture Sensitivity Levels | 1 | |
| Package Description | PLASTIC, DIP-8 | |
| Part Package Code | DIP | |
| Ihs Manufacturer | XILINX INC | |
| Part Life Cycle Code | Obsolete | |
| Rohs Code | No | |
| JESD-609 Code | e0 | |
| Pbfree Code | No | |
| ECCN Code | 3A991.B.1.B.1 | |
| Terminal Finish | Tin/Lead (Sn85Pb15) | |
| HTS Code | 8542.32.00.51 | |
| Terminal Position | DUAL | |
| Terminal Form | THROUGH-HOLE | |
| Peak Reflow Temperature (Cel) | 225 | |
| Number of Functions | 1Function | |
| Terminal Pitch | 2.54 mm | |
| Reach Compliance Code | not_compliant | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Pin Count | 8 | |
| JESD-30 Code | R-PDIP-T8 | |
| Qualification Status | Not Qualified | |
| Supply Voltage-Max (Vsup) | 3.6 V | |
| Temperature Grade | COMMERCIAL | |
| Supply Voltage-Min (Vsup) | 3 V | |
| Operating Mode | SYNCHRONOUS | |
| Organization | 1335872X1 | |
| Seated Height-Max | 4.5974 mm | |
| Memory Width | 1 | |
| Memory Density | 1335872 bit | |
| Parallel/Serial | SERIAL | |
| Memory IC Type | CONFIGURATION MEMORY | |
| Width | 7.62 mm | |
| Length | 9.3599 mm |
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