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XC17S05XLPDG8C Tech Specifications

Xilinx  XC17S05XLPDG8C technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.

Surface Mount NO
Number of Terminals 8Terminals
Moisture Sensitivity Levels 1
Number of Words 54544 wordsWord
Number of Words Code 54544Words Codes
Operating Temperature-Max 70 °C
Package Body Material PLASTIC/EPOXY
Package Code DIP
Package Shape RECTANGULAR
Package Style IN-LINE
Supply Voltage-Nom (Vsup) 3.3 V
Rohs Code Yes
Part Life Cycle Code Obsolete
Ihs Manufacturer XILINX INC
Part Package Code DIP
Package Description DIP,
JESD-609 Code e3
Pbfree Code Yes
ECCN Code EAR99
Terminal Finish Matte Tin (Sn)
HTS Code 8542.32.00.71
Terminal Position DUAL
Terminal Form THROUGH-HOLE
Peak Reflow Temperature (Cel) 250
Number of Functions 1Function
Terminal Pitch 2.54 mm
Reach Compliance Code compliant
Time@Peak Reflow Temperature-Max (s) 30
Pin Count 8
JESD-30 Code R-PDIP-T8
Qualification Status Not Qualified
Supply Voltage-Max (Vsup) 3.6 V
Temperature Grade COMMERCIAL
Supply Voltage-Min (Vsup) 3 V
Operating Mode SYNCHRONOUS
Organization 54544X1
Seated Height-Max 4.5974 mm
Memory Width 1
Memory Density 54544 bit
Memory IC Type MEMORY CIRCUIT
Length 9.3599 mm
Width 7.62 mm
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XC17S05XLPDG8C Documents

Download datasheets and manufacturer documentation for   XC17S05XLPDG8C

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