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- XC17256EVOG8I
AMD Xilinx XC17256EVOG8I Memory ICs
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XC17256EVOG8I Tech Specifications
Xilinx XC17256EVOG8I technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.
| Surface Mount | YES | |
| Number of Terminals | 8Terminals | |
| Package Description | TSOP2, | |
| Part Package Code | TSOP | |
| Ihs Manufacturer | XILINX INC | |
| Part Life Cycle Code | Obsolete | |
| Rohs Code | Yes | |
| Package Style | SMALL OUTLINE, THIN PROFILE | |
| Package Shape | RECTANGULAR | |
| Package Code | TSOP2 | |
| Package Body Material | PLASTIC/EPOXY | |
| Operating Temperature-Min | -40 °C | |
| Operating Temperature-Max | 85 °C | |
| Number of Words Code | 256000Words Codes | |
| Number of Words | 262144 wordsWord | |
| Moisture Sensitivity Levels | 3 | |
| Supply Voltage-Nom (Vsup) | 5 V | |
| JESD-609 Code | e3 | |
| ECCN Code | EAR99 | |
| Terminal Finish | Matte Tin (Sn) | |
| Additional Feature | USED FOR STORING THE CONFIGURATION BITSTREAMS OF XILINX FPGAS | |
| HTS Code | 8542.32.00.51 | |
| Terminal Position | DUAL | |
| Terminal Form | GULL WING | |
| Peak Reflow Temperature (Cel) | 260 | |
| Number of Functions | 1Function | |
| Terminal Pitch | 1.27 mm | |
| Reach Compliance Code | compliant | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Pin Count | 8 | |
| JESD-30 Code | R-PDSO-G8 | |
| Qualification Status | Not Qualified | |
| Supply Voltage-Max (Vsup) | 5.5 V | |
| Temperature Grade | INDUSTRIAL | |
| Supply Voltage-Min (Vsup) | 4.5 V | |
| Operating Mode | SYNCHRONOUS | |
| Organization | 256KX1 | |
| Seated Height-Max | 1.1938 mm | |
| Memory Width | 1 | |
| Memory Density | 262144 bit | |
| Parallel/Serial | SERIAL | |
| Memory IC Type | CONFIGURATION MEMORY | |
| Length | 4.9276 mm | |
| Width | 3.937 mm |
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