PZ3064DS12BP Tech Specifications

Xilinx  PZ3064DS12BP technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.

Surface Mount YES
Number of Terminals 100Terminals
Rohs Code No
Part Life Cycle Code Obsolete
Ihs Manufacturer XILINX INC
Package Description QFP, TQFP100,.63SQ
Moisture Sensitivity Levels 3
Operating Temperature-Max 85 °C
Operating Temperature-Min -40 °C
Package Body Material PLASTIC/EPOXY
Package Code QFP
Package Equivalence Code TQFP100,.63SQ
Package Shape SQUARE
Package Style FLATPACK
Additional Feature YES
HTS Code 8542.39.00.01
Terminal Position QUAD
Terminal Form GULL WING
Peak Reflow Temperature (Cel) 240
Terminal Pitch 0.5 mm
Reach Compliance Code unknown
Time@Peak Reflow Temperature-Max (s) 30
JESD-30 Code S-PQFP-G100
Qualification Status Not Qualified
Temperature Grade INDUSTRIAL
Propagation Delay 13.5 ns
Programmable Logic Type EE PLD
Number of Macro Cells 64Macro Cells
JTAG BST YES
In-System Programmable YES
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PZ3064DS12BP Documents

Download datasheets and manufacturer documentation for   PZ3064DS12BP

  • Datasheets
PZ3064DS12BP brand manufacturers: AMD Xilinx, Twicea stock, PZ3064DS12BP reference price.AMD Xilinx. PZ3064DS12BP parameters, PZ3064DS12BP Datasheet PDF and pin diagram description download.You can use the PZ3064DS12BP Embedded - PLDs (Programmable Logic Device), DSP Datesheet PDF, find PZ3064DS12BP pin diagram and circuit diagram and usage method of function,PZ3064DS12BP electronics tutorials.You can download from the Twicea.