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- XCZU27DR-2FFVE1156E
AMD XCZU27DR-2FFVE1156E Application Specific MCUs
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XCZU27DR-2FFVE1156E Tech Specifications
AMD XCZU27DR-2FFVE1156E technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.
| Surface Mount | YES | |
| Number of Terminals | 1156Terminals | |
| Rohs Code | Yes | |
| Part Life Cycle Code | Active | |
| Ihs Manufacturer | ADVANCED MICRO DEVICES INC | |
| Operating Temperature-Max | 100 °C | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Shape | RECTANGULAR | |
| Package Style | GRID ARRAY | |
| Supply Voltage-Max | 0.876 V | |
| Supply Voltage-Min | 0.825 V | |
| Supply Voltage-Nom | 0.85 V | |
| JESD-609 Code | e1 | |
| Terminal Finish | TIN SILVER COPPER | |
| Terminal Position | BOTTOM | |
| Terminal Form | BALL | |
| Peak Reflow Temperature (Cel) | 245 | |
| Reach Compliance Code | compliant | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| JESD-30 Code | R-PBGA-B1156 | |
| Temperature Grade | OTHER | |
| uPs/uCs/Peripheral ICs Type | RFSOC | |
| Saturation Current | 4 |
XCZU27DR-2FFVE1156E Documents
Download datasheets and manufacturer documentation for XCZU27DR-2FFVE1156E
- Datasheetsf3202775c73511a6d6cd971062fb32c0.pdf
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