XC3S400AN-5FTG256C Tech Specifications

AMD  XC3S400AN-5FTG256C technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.

Mounting Type Through Hole
Package / Case Radial
Supplier Device Package 256-FTBGA (17x17)
Dielectric Material Polypropylene (PP), Metallized
Lead Free Status / RoHS Status --
Voltage Rating DC 1000V (1kV)
Voltage Rating AC 400V
Number of I/Os 195I/Os
Package Tray
Base Product Number XC3S400
Mfr AMD
Product Status Active
Operating Temperature -55°C ~ 105°C
Series KP/MKP 375
Packaging Bulk
Size / Dimension 1.181 L x 0.433 W (30.00mm x 11.00mm)
Tolerance ±5%
Part Status Active
Moisture Sensitivity Level (MSL) --
Termination PC Pins
Applications High Pulse, DV/DT
Capacitance 0.11µF
Voltage - Supply 1.14V ~ 1.26V
Lead Spacing 0.394 (10.00mm)
Number of Logic Elements/Cells 8064Logic Elements/Cells
Total RAM Bits 368640
Number of Gates 400000Gates
Number of LABs/CLBs 896LABs/CLBs
Speed Grade 5
Features --
Height Seated (Max) 0.925 (23.50mm)
Ratings --
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