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XC3S400-4FTG256C Tech Specifications

AMD  XC3S400-4FTG256C technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.

Mounting Type Surface Mount
Package / Case DO-213AA (Glass)
Supplier Device Package DO-213AA (GL34)
Number of I/Os 173I/Os
Package Tray
Base Product Number XC3S400
Mfr AMD
Product Status Active
Series SUPERECTIFIER®
Packaging Tape & Reel (TR)
Operating Temperature 0°C ~ 85°C (TJ)
Part Status Active
Voltage - Supply 1.14V ~ 1.26V
Base Part Number BYM07-100
Speed Fast Recovery = 200mA (Io)
Diode Type Standard
Current - Reverse Leakage @ Vr 5µA @ 100V
Voltage - Forward (Vf) (Max) @ If 1.25V @ 500mA
Operating Temperature - Junction -65°C ~ 175°C
Voltage - DC Reverse (Vr) (Max) 100V
Current - Average Rectified (Io) 500mA
Number of Logic Elements/Cells 8064Logic Elements/Cells
Total RAM Bits 294912
Capacitance @ Vr, F 7pF @ 4V, 1MHz
Number of Gates 400000Gates
Number of LABs/CLBs 896LABs/CLBs
Speed Grade 4
Reverse Recovery Time (trr) 50ns
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