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SC1100UFH-233 Tech Specifications
AMD SC1100UFH-233 technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.
| Surface Mount | YES | |
| Number of Terminals | 388Terminals | |
| Rohs Code | No | |
| Part Life Cycle Code | Obsolete | |
| Ihs Manufacturer | ADVANCED MICRO DEVICES INC | |
| Part Package Code | BGA | |
| Package Description | 35 X 35 MM, 2.38 MM HEIGHT, 1.27 MM PITCH, MS-034BAR-2, TEPBGA-388 | |
| Clock Frequency-Max | 27 MHz | |
| Moisture Sensitivity Levels | 3 | |
| Operating Temperature-Max | 85 °C | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | HBGA | |
| Package Equivalence Code | BGA388,26X26,50 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY, HEAT SINK/SLUG | |
| Supply Voltage-Max | 1.89 V | |
| Supply Voltage-Min | 1.71 V | |
| Supply Voltage-Nom | 1.8 V | |
| JESD-609 Code | e0 | |
| ECCN Code | 3A991.A.2 | |
| Terminal Finish | TIN LEAD | |
| HTS Code | 8542.31.00.01 | |
| Terminal Position | BOTTOM | |
| Terminal Form | BALL | |
| Peak Reflow Temperature (Cel) | 260 | |
| Terminal Pitch | 1.27 mm | |
| Reach Compliance Code | not_compliant | |
| Pin Count | 388 | |
| JESD-30 Code | S-PBGA-B388 | |
| Qualification Status | Not Qualified | |
| Temperature Grade | OTHER | |
| Speed | 233 MHz | |
| uPs/uCs/Peripheral ICs Type | MICROPROCESSOR | |
| Bit Size | 32 | |
| Seated Height-Max | 2.59 mm | |
| Address Bus Width | 13 | |
| Boundary Scan | YES | |
| Low Power Mode | YES | |
| External Data Bus Width | 64 | |
| Format | FLOATING POINT | |
| Integrated Cache | YES | |
| Length | 35 mm | |
| Width | 35 mm |
SC1100UFH-233 Documents
Download datasheets and manufacturer documentation for SC1100UFH-233
- DatasheetsAMDIS04373-1.pdf
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