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- S29GL256P10FFI013
AMD S29GL256P10FFI013 Memory Modules
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S29GL256P10FFI013 Tech Specifications
AMD S29GL256P10FFI013 technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.
| Surface Mount | YES | |
| Number of Terminals | 64Terminals | |
| Rohs Code | Yes | |
| Part Life Cycle Code | Transferred | |
| Ihs Manufacturer | ADVANCED MICRO DEVICES INC | |
| Access Time-Max | 100 ns | |
| Number of Words | 16777216 wordsWord | |
| Number of Words Code | 16000000Words Codes | |
| Operating Temperature-Max | 85 °C | |
| Operating Temperature-Min | -40 °C | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Equivalence Code | BGA64,8X8,40 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| ECCN Code | EAR99 | |
| Type | NOR TYPE | |
| HTS Code | 8542.32.00.51 | |
| Terminal Position | BOTTOM | |
| Terminal Form | BALL | |
| Number of Functions | 1Function | |
| Terminal Pitch | 1 mm | |
| Reach Compliance Code | unknown | |
| JESD-30 Code | S-PBGA-B64 | |
| Qualification Status | Not Qualified | |
| Temperature Grade | INDUSTRIAL | |
| Operating Mode | ASYNCHRONOUS | |
| Supply Current-Max | 0.08 mA | |
| Organization | 16MX16 | |
| Output Characteristics | 3-STATE | |
| Memory Width | 16 | |
| Standby Current-Max | 0.000005 A | |
| Memory Density | 268435456 bit | |
| Parallel/Serial | PARALLEL | |
| Memory IC Type | FLASH | |
| Alternate Memory Width | 8 | |
| Data Polling | YES | |
| Toggle Bit | YES | |
| Command User Interface | YES | |
| Number of Sectors/Size | 256Sectors/Sizes | |
| Sector Size | 128K | |
| Page Size | 8/16 words | |
| Ready/Busy | YES | |
| Common Flash Interface | YES |
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