AMD GE209HISJ23HM Embedded Microprocessors AMPMODU Mod II
GE209HISJ23HM
126-490-GE209HISJ23HM
RoHS Compliant
uPs/uCs/Peripheral ICs Type: MICROPROCESSOR CIRCUIT
In Stock Min. : 1
Mult. : 1
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GE209HISJ23HM Tech Specifications
AMD GE209HISJ23HM technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.
| Factory Lead Time | 16 Weeks | |
| Mounting Type | Through Hole | |
| Surface Mount | YES | |
| Contact Shape | Square | |
| Voltage, Rating | - | |
| Package | Bulk | |
| Base Product Number | 146252 | |
| Mated Stacking Heights | - | |
| Mfr | TE Connectivity AMP Connectors | |
| Product Status | Active | |
| Contact Materials | Copper Alloy | |
| Contact Finish Mating | Gold | |
| Insulation Materials | Liquid Crystal Polymer (LCP) | |
| Contact Length-Mating | 0.318 (8.08mm) | |
| Package Description | BGA, | |
| Package Style | GRID ARRAY | |
| Package Body Material | PLASTIC/EPOXY | |
| Manufacturer Part Number | GE209HISJ23HM | |
| Package Code | BGA | |
| Package Shape | SQUARE | |
| Manufacturer | AMD | |
| Part Life Cycle Code | Active | |
| Ihs Manufacturer | ADVANCED MICRO DEVICES INC | |
| Risk Rank | 5.6 | |
| Operating Temperature | -65°C ~ 105°C | |
| Series | AMPMODU Mod II | |
| Termination | Solder | |
| Connector Type | Header, Breakaway | |
| Number of Positions | 72Positions | |
| Applications | - | |
| Number of Rows | 2Rows | |
| HTS Code | 8542.31.00.01 | |
| Fastening Type | Push-Pull | |
| Contact Type | Male Pin | |
| Current Rating (Amps) | 3A | |
| Technology | CMOS | |
| Terminal Position | BOTTOM | |
| Terminal Form | BALL | |
| Ingress Protection | - | |
| Insulation Height | 0.090 (2.29mm) | |
| Style | Board to Board or Cable | |
| Number of Positions Loaded | All | |
| Reach Compliance Code | compliant | |
| Pitch - Mating | 0.100 (2.54mm) | |
| Insulation Color | Black | |
| Pin Count | 769 | |
| JESD-30 Code | S-PBGA-B | |
| Row Spacing - Mating | 0.100 (2.54mm) | |
| Contact Length - Post | 0.125 (3.18mm) | |
| Shrouding | Unshrouded | |
| Contact Finish - Post | Tin | |
| Overall Contact Length | 0.533 (13.55mm) | |
| Interface | SPI/USB | |
| uPs/uCs/Peripheral ICs Type | MICROPROCESSOR CIRCUIT | |
| Features | - | |
| Contact Finish Thickness - Mating | 15.0µin (0.38µm) | |
| Contact Finish Thickness - Post | 100.0µin (2.54µm) | |
| Material Flammability Rating | UL94 V-0 |
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