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- EF-DI-TCCDEC-UMTS-WW
AMD EF-DI-TCCDEC-UMTS-WW
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EF-DI-TCCDEC-UMTS-WW Tech Specifications
AMD EF-DI-TCCDEC-UMTS-WW technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.
| Material | Silicone Elastomer | |
| Shape | Square | |
| Package | Electronic Delivery | |
| Mfr | AMD | |
| Product Status | Obsolete | |
| For Use With/Related Products | Xilinx | |
| Operating Systems | - | |
| Series | Tputty™ 502 | |
| Part Status | Active | |
| Type | Jar, Sheet | |
| Color | White | |
| Applications | - | |
| Usage | -- | |
| Adhesive | Tacky - Both Sides | |
| Backing, Carrier | Fiberglass | |
| Outline | 228.60mm x 228.60mm | |
| Thermal Conductivity | 3.0 W/m-K | |
| Media Delivery Type | Electronically Delivered | |
| License - User Details | Worldwide | |
| License Length | 1 Year | |
| Thermal Resistivity | -- | |
| Edition | - | |
| Thickness | 0.0900 (2.286mm) |
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