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- AM29LS33/BFA
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AM29LS33/BFA Tech Specifications
AMD AM29LS33/BFA technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.
| Contact Plating | Lead, Tin | |
| Mount | Through Hole | |
| RoHS | Compliant | |
| Packaging | Bulk | |
| Tolerance | 0.02 % | |
| Number of Terminations | 2Terminations | |
| Temperature Coefficient | 1 ppm/°C | |
| Resistance | 30 kΩ | |
| Max Operating Temperature | 175 °C | |
| Min Operating Temperature | -55 °C | |
| Composition | Metal Foil | |
| Max Power Dissipation | 300 mW | |
| Features | Moisture Resistant | |
| Width | 2.667 mm | |
| Height | 8.5344 mm | |
| Length | 7.62 mm | |
| Radiation Hardening | No |
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