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10AS048K3F35I2SG Tech Specifications
ALTERA 10AS048K3F35I2SG technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.
| Package / Case | Axial | |
| Surface Mount | YES | |
| Supplier Device Package | Axial | |
| Number of Terminals | 1152Terminals | |
| Package | Tape & Reel (TR) | |
| Base Product Number | RNC60 | |
| Mfr | Vishay Dale | |
| Product Status | Active | |
| Number of I/Os | 396I/Os | |
| Moisture Sensitive | Yes | |
| Shipping Restrictions | This product may require additional documentation to export from the United States. | |
| L1 Cache Instruction Memory | 2 x 32 kB | |
| Maximum Clock Frequency | 1.2 GHz | |
| Number of Logic Elements | 480000 LELogic Element | |
| Factory Pack QuantityFactory Pack Quantity | 1 | |
| Mounting Styles | SMD/SMT | |
| Number of Logic Array Blocks - LABs | 60000 LABLogic Array Blocks - LAB | |
| Part # Aliases | 965306 | |
| Manufacturer | Intel | |
| Brand | Intel / Altera | |
| Tradename | Arria 10 SoC | |
| RoHS | Details | |
| L1 Cache Data Memory | 2 x 32 kB | |
| Data RAM Size | - | |
| Package Description | BGA, BGA1152,34X34,40 | |
| Package Style | GRID ARRAY | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Equivalence Code | BGA1152,34X34,40 | |
| Operating Temperature-Min | -40 °C | |
| Supply Voltage-Nom | 0.9 V | |
| Reflow Temperature-Max (s) | NOT SPECIFIED | |
| Supply Voltage-Min | 0.87 V | |
| Operating Temperature-Max | 100 °C | |
| Rohs Code | Yes | |
| Manufacturer Part Number | 10AS048K3F35I2SG | |
| Package Code | BGA | |
| Package Shape | SQUARE | |
| Part Life Cycle Code | Active | |
| Ihs Manufacturer | INTEL CORP | |
| Supply Voltage-Max | 0.93 V | |
| Risk Rank | 5.47 | |
| Operating Temperature | -65°C ~ 175°C | |
| Series | Military, MIL-PRF-55182/03, RNC60 | |
| Packaging | Tray | |
| Size / Dimension | 0.097 Dia x 0.280 L (2.46mm x 7.11mm) | |
| Tolerance | ±0.1% | |
| Part Status | Active | |
| Number of Terminations | 2Terminations | |
| Temperature Coefficient | ±50ppm/°C | |
| Resistance | 124 Ohms | |
| Composition | Metal Film | |
| Power (Watts) | 0.25W, 1/4W | |
| HTS Code | 8542.39.00.01 | |
| Subcategory | SOC - Systems on a Chip | |
| Technology | CMOS | |
| Terminal Position | BOTTOM | |
| Terminal Form | BALL | |
| Peak Reflow Temperature (Cel) | NOT SPECIFIED | |
| Terminal Pitch | 1 mm | |
| Reach Compliance Code | compliant | |
| JESD-30 Code | S-PBGA-B1152 | |
| Number of Outputs | 396Outputs | |
| Qualification Status | Not Qualified | |
| Failure Rate | M (1%) | |
| Power Supplies | 0.9 V | |
| Temperature Grade | INDUSTRIAL | |
| Speed | 1.5GHz | |
| RAM Size | 256KB | |
| Core Processor | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | |
| Peripherals | DMA, POR, WDT | |
| Program Memory Size | - | |
| Connectivity | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | |
| Architecture | MCU, FPGA | |
| Number of Inputs | 396Inputs | |
| Seated Height-Max | 3.5 mm | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Product Type | SoC FPGA | |
| Primary Attributes | FPGA - 480K Logic Elements | |
| Number of Logic Cells | 480000Logic Cells | |
| Number of Cores | 2 CoreCore | |
| Flash Size | -- | |
| Features | Military, Moisture Resistant, Weldable | |
| Product Category | SoC FPGA | |
| Height Seated (Max) | - | |
| Width | 35 mm | |
| Length | 35 mm |
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