ALTERA 10AS048K2F35E1SG System On Chip 256KB BOTTOM CMOS
10AS048K2F35E1SG
117-492-10AS048K2F35E1SG
1152-BBGA, FCBGA
RoHS Compliant
RAM Size: 256KB,Packaging: Tray,Series: MF25
In Stock Min. : 1
Mult. : 1
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10AS048K2F35E1SG Tech Specifications
ALTERA 10AS048K2F35E1SG technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.
| Mounting Type | Free Hanging (In-Line) | |
| Package / Case | 1152-BBGA, FCBGA | |
| Surface Mount | YES | |
| Mounting Feature | - | |
| Shell Material | Aluminum Die Cast, Brass | |
| Supplier Device Package | 1152-FBGA (35x35) | |
| Insert Material | Synthetic Resin | |
| Number of Terminals | 1152Terminals | |
| Backshell Material, Plating | - | |
| Voltage, Rating | 300VAC, 420VDC | |
| Package | Bag | |
| Primary Material | Metal | |
| Mfr | Hirose Electric Co Ltd | |
| Product Status | Last Time Buy | |
| Contact Materials | Brass | |
| Contact Finish Mating | Silver | |
| Number of I/Os | 396I/Os | |
| Package Description | 35 X 35 MM, ROHS COMPLIANT, FBGA-1152 | |
| Package Style | GRID ARRAY | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Equivalence Code | BGA1152,34X34,40 | |
| Supply Voltage-Nom | 0.9 V | |
| Reflow Temperature-Max (s) | NOT SPECIFIED | |
| Supply Voltage-Min | 0.87 V | |
| Operating Temperature-Max | 100 °C | |
| Rohs Code | Yes | |
| Manufacturer Part Number | 10AS048K2F35E1SG | |
| Package Code | BGA | |
| Package Shape | SQUARE | |
| Manufacturer | Intel Corporation | |
| Part Life Cycle Code | Obsolete | |
| Ihs Manufacturer | INTEL CORP | |
| Supply Voltage-Max | 0.93 V | |
| Risk Rank | 5.68 | |
| Operating Temperature | -40°C ~ 75°C | |
| Series | MF25 | |
| Packaging | Tray | |
| Part Status | Discontinued at Digi-Key | |
| Termination | Solder Cup | |
| Connector Type | Plug, Female Sockets | |
| Number of Positions | 5 (3 + 2 Fiber Optic)Position | |
| Color | Black | |
| Applications | Transportation | |
| HTS Code | 8542.39.00.01 | |
| Fastening Type | Threaded | |
| Subcategory | Field Programmable Gate Arrays | |
| Current Rating (Amps) | 30A | |
| Technology | CMOS | |
| Terminal Position | BOTTOM | |
| Orientation | Keyed | |
| Terminal Form | BALL | |
| Shielding | Unshielded | |
| Peak Reflow Temperature (Cel) | NOT SPECIFIED | |
| Ingress Protection | IP67 - Dust Tight, Waterproof | |
| Terminal Pitch | 1 mm | |
| Reach Compliance Code | compliant | |
| Shell Finish | Black Chrome | |
| Shell Size - Insert | - | |
| JESD-30 Code | S-PBGA-B1152 | |
| Number of Outputs | 396Outputs | |
| Qualification Status | Not Qualified | |
| Power Supplies | 0.9 V | |
| Temperature Grade | OTHER | |
| Speed | 1.5GHz | |
| RAM Size | 256KB | |
| Shell Size, MIL | - | |
| Core Processor | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | |
| Peripherals | DMA, POR, WDT | |
| Connectivity | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | |
| Cable Opening | - | |
| Architecture | MCU, FPGA | |
| Number of Inputs | 396Inputs | |
| Seated Height-Max | 3.5 mm | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Primary Attributes | FPGA - 480K Logic Elements | |
| Number of Logic Cells | 480000Logic Cells | |
| Flash Size | -- | |
| Features | Backshell, Cable Clamp, Coupling Nut | |
| Width | 35 mm | |
| Length | 35 mm | |
| Contact Finish Thickness - Mating | - | |
| Material Flammability Rating | UL94 V-0 |
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