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10AS022C3U19E2SG Tech Specifications

ALTERA  10AS022C3U19E2SG technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.

Package / Case 1206 (3216 Metric)
Surface Mount YES
Supplier Device Package 1206
Number of Terminals 484Terminals
Package Tape & Reel (TR)
Base Product Number TNPW1206
Mfr Vishay Dale
Product Status Active
Number of I/Os 192I/Os
RoHS Non-Compliant
Moisture Sensitive Yes
Shipping Restrictions This product may require additional documentation to export from the United States.
L1 Cache Instruction Memory 2 x 32 kB
Maximum Clock Frequency 1.2 GHz
Number of Logic Elements 220000 LELogic Element
Unit Weight 0.423288 oz
Factory Pack QuantityFactory Pack Quantity 1
Mounting Styles SMD/SMT
Number of Logic Array Blocks - LABs 27500 LABLogic Array Blocks - LAB
Part # Aliases 964699
Manufacturer Intel
Brand Intel / Altera
Tradename Arria 10 SoC
L1 Cache Data Memory 2 x 32 kB
Data RAM Size -
Package Description FBGA, BGA484,22X22,32
Package Style GRID ARRAY, FINE PITCH
Package Body Material PLASTIC/EPOXY
Package Equivalence Code BGA484,22X22,32
Supply Voltage-Nom 0.9 V
Reflow Temperature-Max (s) NOT SPECIFIED
Supply Voltage-Min 0.87 V
Operating Temperature-Max 100 °C
Rohs Code Yes
Manufacturer Part Number 10AS022C3U19E2SG
Package Code FBGA
Package Shape SQUARE
Part Life Cycle Code Active
Ihs Manufacturer INTEL CORP
Supply Voltage-Max 0.93 V
Risk Rank 5.47
Operating Temperature -55°C ~ 155°C
Series TNPW e3
Packaging Tray
Size / Dimension 0.126 L x 0.063 W (3.20mm x 1.60mm)
Tolerance ±0.5%
Part Status Active
Number of Terminations 2Terminations
Temperature Coefficient ±25ppm/°C
Resistance 5.36 kOhms
Composition Thin Film
Power (Watts) 0.25W, 1/4W
HTS Code 8542.39.00.01
Subcategory SOC - Systems on a Chip
Technology CMOS
Terminal Position BOTTOM
Terminal Form BALL
Peak Reflow Temperature (Cel) NOT SPECIFIED
Terminal Pitch 0.8 mm
Reach Compliance Code compliant
JESD-30 Code S-PBGA-B484
Number of Outputs 192Outputs
Qualification Status Not Qualified
Failure Rate -
Power Supplies 0.9 V
Temperature Grade OTHER
Speed 1.5GHz
RAM Size 256KB
Core Processor Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
Peripherals DMA, POR, WDT
Program Memory Size -
Connectivity EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Architecture MCU, FPGA
Number of Inputs 192Inputs
Seated Height-Max 3.25 mm
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY
Product Type SoC FPGA
Primary Attributes FPGA - 220K Logic Elements
Number of Logic Cells 220000Logic Cells
Number of Cores 2 CoreCore
Flash Size --
Features Anti-Sulfur, Automotive AEC-Q200, Moisture Resistant
Product Category SoC FPGA
Height Seated (Max) 0.026 (0.65mm)
Width 19 mm
Length 19 mm
Ratings AEC-Q200
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