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AM27S35/BUA Tech Specifications

AMD  AM27S35/BUA technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.

Factory Lead Time 1 Week
Package / Case 32-CLCC
Mounting Type Surface Mount
Surface Mount YES
Supplier Device Package 32-CLCC
Number of Terminals 32Terminals
Base Product Number AM27S35
Mfr Advanced Micro Devices
Memory Types Non-Volatile
Product Status Active
Package Bulk
Package Description QCCN, LCC32,.45X.55
Package Style CHIP CARRIER
Number of Words Code 1000Words Codes
Package Body Material CERAMIC, METAL-SEALED COFIRED
Package Equivalence Code LCC32,.45X.55
Operating Temperature-Min -55 °C
Operating Temperature-Max 125 °C
Rohs Code No
Manufacturer Part Number AM27S35/BUA
Number of Words 1024 wordsWord
Supply Voltage-Nom (Vsup) 5 V
Package Code QCCN
Package Shape RECTANGULAR
Manufacturer AMD
Part Life Cycle Code Obsolete
Ihs Manufacturer ADVANCED MICRO DEVICES INC
Risk Rank 5.41
Part Package Code QFJ
Usage Level Military grade
Series -
Operating Temperature -55°C ~ 125°C (TC)
JESD-609 Code e0
ECCN Code EAR99
Terminal Finish Tin/Lead (Sn/Pb)
HTS Code 8542.32.00.71
Subcategory OTP ROMs
Voltage - Supply 4.5V ~ 5.5V
Terminal Position QUAD
Terminal Form NO LEAD
Number of Functions 1Function
Terminal Pitch 1.27 mm
Reach Compliance Code unknown
Pin Count 32
JESD-30 Code R-CQCC-N32
Qualification Status Not Qualified
Supply Voltage-Max (Vsup) 5.5 V
Temperature Grade MILITARY
Supply Voltage-Min (Vsup) 4.5 V
Memory Size 8Kbit
Operating Mode SYNCHRONOUS
Access Time 45 ns
Memory Format PROM
Memory Interface Parallel
Organization 1KX8
Output Characteristics 3-STATE
Seated Height-Max 2.54 mm
Memory Width 8
Write Cycle Time - Word, Page -
Memory Density 8192 bit
Screening Level 38535Q/M;38534H;883B
Parallel/Serial PARALLEL
Memory IC Type OTP ROM
Memory Organization 1K x 8
Width 11.43 mm
Length 13.97 mm
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